RF/DC UHV sputtering source for 10.0″ x 0.38″ target

For angled round sputtering configurations with rotating substrates, A300-XP sources are typically fitted with the “in-site-tilt” option. This option, allows the source angle to be precisely adjusted from outside the vacuum chamber. Fine tuning the incident angle is critical to achieving good deposition uniformity when working distances, operating pressures and materials are changed. While fixed angle arrangements limit and often compromise the capabilities of a system, “in-tilt-tilt” can deliver better than +/- 2% uniformity on substrates which can be up to triple the diameter of the source targets.