Category: UHV Round Sputter Kathode

The A300-XP SERIES magnetron sputtering sources feature a Modular Magnet Array that is separated from the cooling water. This design allows for easy access to the internal magnet arrangement, enabling versatile configurations such as uniform or intentionally non-uniform depositions, balanced magnetron operation, and maximizing target utilization.

Additionally, it facilitates operation with high or low electron energies, magnetic material targets, various unbalanced magnetron configurations, and high or low-rate sputtering setups.

It enables magnetic material sputtering of thicker targets and easy removal of larger magnetic targets, while also incorporating an integral gas injection and chimney system for enhanced efficiency.

The system offers RF & DC compatibility, true UHV construction, broad operating pressure range, tilt options for uniformity optimization, and customization possibilities, with source/power supply/target packages readily available.

Target diameter A310 -A320                       1.0” to 6.0”
Maximum Power – DC/RF (Watt)              150/150 to 2500 / 1500
Cooling water (liters / minute)                   0.5 – 5.0
Source head diameter                                 1.33” to 7.70”
Source head height                                      2.00” to 6.00”