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Category: HV Round Sputter Kathode

Round sputtering sources feature a `modular magnet array` which is completely isolated from the cooling water to eliminate magnet deterioration and subsequent degradation of source performance. This design permits easy access to the internal magnetic component arrangement thus allowing the same source to be operated

They enable operation as both balanced and unbalanced magnetrons, with compatibility for magnetic material targets and diode sputtering.

Contrary to conventional wisdom, these sources can achieve excellent uniformity, with variable in-situ tilt angles contributing to enhanced performance. For instance, uniformities exceeding +/- 1% have been attained on 4.0” substrates using angled ST20 sources (with a 2.0’’ target) and simple substrate rotation.

Target diameter: ST10 -ST40                      1.0” to 4.0”
Maximum Power – DC/RF (Watt)              150/150 to 1500 / 1000
Cooling water (liters / minute)                   0.5 – 3.0
Source head diameter [in (mm)]              1.80” (45.7) to 5.63” (143.0)
Source head height [in (mm)]                    1.50” (38.1) to 4.80” (122.0)

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